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Aluminum Nitride Ceramics
Aluminum Nitride(AlN) combine high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications. Unlike many electronically insulative materials-which are often also thermally insulative. AlN allows electrical systems to dissipate heat quickly in order to maintain maximum efficiency.
Main Properties of Alumium Nitride Ceramics
* Tests under room temperature environment;
* The above information is offered for comparison only. Exact
properties will vary depending on the manufacturing method
and part configuration.
Key Attributes&Advantages of Alumium Nitride Ceramics
- High heat dissipation with thermal conductivity 170 W/m.K
- Non-toxic alternative to BeO
- Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
- High dielectric strength
- very low porosity
- Pressure Assisted Densification(PAD)
- Utilizes hot pressing technology
- High heat dissipation with thermal conductivity 170 W/m.K
- Non-toxic alternative to BeO
- Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
- High dielectric strength
- very low porosity
- Pressure Assisted Densification(PAD)
- Utilizes hot pressing technology
